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SLN-VIZN3D-IOT

Development Kit, MIMXRT117FDVMAA, 32 Bit, ARM, Cortex-M4, Cortex-M7

NXP SLN-VIZN3D-IOT
NXP SLN-VIZN3D-IOT
NXP SLN-VIZN3D-IOT
NXP SLN-VIZN3D-IOT
NXP SLN-VIZN3D-IOT
NXP SLN-VIZN3D-IOT
NXP SLN-VIZN3D-IOT
NXP SLN-VIZN3D-IOT
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Manufacturer:
NXP NXP
Manufacturer Part No:
SLN-VIZN3D-IOT
Order Code:
3879170
Technical Datasheet:
SLN-VIZN3D-IOT   Datasheet
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Product Information

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:
NXP

:
32bit

:
i.MX

:
ARM

:
Cortex-M4, Cortex-M7

:
MIMXRT117FDVMAA

:
Dev Kit MIMXRT117FDVMAA, USB Type-A to USB Type-C Cable

:
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Technical Documents (1)

CAD Downloads

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Terms and Conditions

CAD Models - Notice
CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
Use of these CAD models and other options provided are downloaded and used entirely at your own risk and by continuing you confirm acceptance of the above.

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Product Overview

SLN-VIZN3D-IOT is a i.MX RT117F based secure 3D face recognition solution development kit. This NXP's EdgeReady MCU-based solution for 3D face recognition leverages the i.MX RT117F crossover MCU, enabling developers to quickly and easily add 3D face recognition with advanced liveness detection to their products, with the confidence that it will work in even the most challenging outdoor lighting conditions and can resist the most sophisticated spoofing attacks. 3D liveness detection defeats spoofing attempts using photographs or 3D models, and uses a high performance 3D structured light camera module (SLM) with an optional low-cost CMOS sensor-based RGB camera, without requiring the use an expensive, power hungry, Linux-based MPU with long boot times. The development kit for this solution, SLN-VIZN3D-IOT, comes with fully integrated turnkey software, for quick out-of-the-box operation, minimizing time to market, risk and development effort.
  • NXP i.MX RT117F Crossover MCU with 2MB SRAM (i.MX RT117F internal), 32MB QSPI NOR flash module
  • 32 MB SDRAM PC200 module
  • Orbbec 3D SLM camera module with depth and IR sensing
  • Optional RGB camera module with GalaxyCore GC0308 image sensor
  • Optional rocktech TFT display with parallel interface
  • Bluetooth® low-energy module with NXP QN9090/30 BLE 5.0 MCU
  • Optional murata PIR sensor
  • Optional MQS DAC (internal i.MX RT117F) to control inexpensive analogue amplifier
  • Optional white LED strobe with PWM LED driver
  • Optional user/reset switches and RGB status LED

Contents

i.MX RT117F based secure 3D face recognition solution development kit, USB Type-A to USB Type-C cable.

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