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Quantity | Price (ex VAT) |
---|---|
10+ | €0.476 |
50+ | €0.438 |
100+ | €0.400 |
250+ | €0.392 |
500+ | €0.384 |
1500+ | €0.376 |
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Multiple: 10
€4.76 (ex VAT)
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Product Information
ManufacturerAMP - TE CONNECTIVITY
Manufacturer Part No5050864-1
Order Code2452556
InsulationNon Insulated
Mounting Hole Dia1.57mm
Terminal PlatingGold
Overall Length6.53mm
Length - Below Flange6.17mm
Product Range-
SVHCNo SVHC (21-Jan-2025)
Product Overview
The 5050864-1 is a closed bottom discrete Socket Assembly with beryllium copper miniature spring and tin-plated copper sleeve. It is suitable for use with printed circuit board and 22 to 20AWG wire/cable.
- Through-hole - press-fit termination method to PC board
- Solder termination method to wire/cable
- Hand/semi-automatic insertion method
- 6.5A Contact current rating
- -65 to 125°C Operating temperature range
Applications
Industrial
Technical Specifications
Insulation
Non Insulated
Terminal Plating
Gold
Length - Below Flange
6.17mm
SVHC
No SVHC (21-Jan-2025)
Mounting Hole Dia
1.57mm
Overall Length
6.53mm
Product Range
-
Technical Docs (3)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:85366990
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (21-Jan-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.000051
WEEE Code:0000